The binder is generally classified into three types: an organic binder and an inorganic binder, and a metal powder binder. Common organic binders mainly include: epoxy system adhesives, silicone adhesives. The main performance difference between them and inorganic adhesives is temperature resistance. The highest temperature resistance of organic adhesives is usually Between 100-250 degrees, the highest generally does not exceed 400 degrees. The temperature resistance of inorganic binders is usually between 600 and 1750 degrees Celsius. Organic binders may be either soft or rigid, while inorganic binders are generally rigid and rigid. Common metal powder binders mainly include some low melting point metal powders whose temperature resistance depends on the melting point of the metal powder.

Organic binders mainly include: epoxy system adhesives, silicone system adhesives, acrylic system adhesives.

The inorganic binder mainly includes a silicate-based binder, a phosphate-based binder, an aluminate, and the like.

Gold powder powder adhesive mainly includes: pure aluminum powder, etc.

Among them, organic binders are the most widely used and epoxy binders in organic binders are closely related to our lives!

 

Epoxy system adhesive

Generally, in the absence of oxygen, the thermal decomposition temperature of the epoxy resin body is above 300 °C. When used in air, thermal oxidative decomposition generally occurs at 180 to 200 °C. When aging at this temperature for a period of time, the strength decreases even more. Most alicyclic epoxy resins are relatively stable below 200 ° C, but thermal oxidative damage is more severe than bisphenol A epoxy resins above 200 ° C. This may be because the alicyclic ring is not as stable as the aromatic ring. The thermal oxidative stability of the aromatic amine-cured bisphenol A epoxy resin is inferior to that of the alicyclic A-type epoxy resin cured by the alicyclic or aromatic cyclic anhydride. Because there are more hydroxyl groups in the amine-cured epoxy structure. Dehydration reactions are apt to occur at lower temperatures. In addition, the N atom on the amine is also more susceptible to thermal oxidation damage. However, hydroxyl groups are rarely formed in the anhydride cured product. However, the epoxy resin molecular chain of both types of curing agents above 290C will start to break. As can be seen from the above, the bisphenol A type epoxy resin is inferior in high temperature resistance. The cured product of the anhydride has higher temperature resistance than the aromatic amine cured product.